The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Jun. 15, 2017
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Mitsunori Abe, Kawasaki, JP;
Takahiro Kitagawa, Kawasaki, JP;
Shigeo Iriguchi, Kawasaki, JP;
Kiyoyuki Hatanaka, Kawasaki, JP;
Shigeru Sugino, Edogawa, JP;
Ryo Kanai, Kawasaki, JP;
FUJITSU LIMITED, Kawasaki, JP;
Abstract
A method for inspecting a laminated board, includes: performing a reflow process to solder an electronic component to a surface of a laminated board in which at least one of a plurality of wiring layers which are laminated with each other is coupled to another adjacent wiring layer via a via; and inspecting, in the reflow process, a conduction state of the via after a temperature of the laminated board reaches a melting point of a solder, and when the temperature of the laminated board is at a temperature range lower than the melting point and higher than room temperature.