The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Nov. 26, 2015
Applicant:

Hitachi Automotive Systems, Ltd., Ibaraki, JP;

Inventors:

Noriyuki Sakuma, Tokyo, JP;

Yasuo Onose, Ibaraki, JP;

Shinobu Tashiro, Ibaraki, JP;

Ryosuke Doi, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/684 (2006.01); B81B 1/00 (2006.01); G01F 1/692 (2006.01);
U.S. Cl.
CPC ...
G01F 1/6845 (2013.01); B81B 1/00 (2013.01); G01F 1/692 (2013.01);
Abstract

Degradation of reliability of a thermal fluid flow sensor, caused by generation of a crack in an insulating film is prevented in the thermal fluid flow sensor including a detection section and a circuit section formed on the same substrate when stress adjustment is performed by forming a deep concave portion in an interlayer insulating film in the detection section and forming the insulating film having a tensile stress thereon. As a means thereof, stair-like step is provided in a side wall of a concave portion, formed in the interlayer insulating film on a diaphragm. Accordingly, each depth of a first concave portion and a second concave portion, which form the concave portion, is reduced, and coatability of the insulating film for the stress adjustment, which covers a side wall and a bottom face of the concave portion, is improved.


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