The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Nov. 19, 2014
Applicant:
Kabushiki Kaisha Toshiba;
Inventors:
Shingo Tamaru, Kawasaki, JP;
Yuuichi Hanada, Shiraoka, JP;
Dai Murayama, Musashino, JP;
Koji Kimura, Kawasaki, JP;
Masahiko Murai, Hachioji, JP;
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
F24F 11/30 (2018.01); G05B 1/00 (2006.01); F24F 11/46 (2018.01); F24F 11/62 (2018.01); F24F 11/64 (2018.01); G05B 13/02 (2006.01); G01R 22/06 (2006.01); G01R 22/10 (2006.01); F24F 11/52 (2018.01); F24F 110/00 (2018.01); F24F 110/70 (2018.01); F24F 120/10 (2018.01); F24F 140/50 (2018.01); F24F 140/60 (2018.01); F24F 130/30 (2018.01);
U.S. Cl.
CPC ...
F24F 11/30 (2018.01); F24F 11/62 (2018.01); G01R 22/061 (2013.01); G01R 22/10 (2013.01); G05B 1/00 (2013.01); G05B 13/02 (2013.01); F24F 11/46 (2018.01); F24F 11/52 (2018.01); F24F 11/64 (2018.01); F24F 2110/00 (2018.01); F24F 2110/70 (2018.01); F24F 2120/10 (2018.01); F24F 2130/30 (2018.01); F24F 2140/50 (2018.01); F24F 2140/60 (2018.01); G05B 2219/2614 (2013.01);
Abstract
According to an embodiment, a thermal load estimating device receives actual power consumption of various types of devices installed in a room, a thermal load pattern of a time-series maximum thermal load of the room, and power consumption of the various types of devices in the room; estimates a thermal load of the room at appropriate time based on the actual power consumption, the thermal load pattern, and the power consumption; and outputs an estimated thermal-load value as a result of estimation.