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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10393320 B1

PDFFull Text
Expired
Date of Patent:
Aug. 27, 2019

Filed:

Oct. 12, 2018

Method of forming a component module

Applicant:

Molex, Llc, Lisle, IL (US);

Inventors:

Daniel B. McGowan, Glen Ellyn, IL (US);

Michael C. Picini, Aurora, IL (US);

Assignee:

Molex, LLC, Lisle, IL (US);

Attorney:

Molex, LLC

Primary Examiner:

Mary Ellen Bowman

Int. Cl.
CPC ...
F21K 9/20 (2016.01); H05K 1/05 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); F21Y 115/10 (2016.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
F21K 9/20 (2016.08); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/647 (2013.01); H05K 1/05 (2013.01); H05K 1/183 (2013.01); H05K 3/0026 (2013.01); H05K 3/12 (2013.01); F21Y 2115/10 (2016.08); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01); H05K 1/117 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/09081 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01);
Abstract

A method of forming a component module is disclosed. A base is provided, the base being electrically conductive. An insulative layer is also provided on the base, with a first area being substantially free of the insulative layer. First and second traces are provided on the insulative layer adjacent the first area, with these traces extending therefrom. A die is positioned on the first area and electrically connected to the first and second traces. Finally, a protective layer is provided over the die.

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McGowan, Daniel. (2019). Method of forming a component module (U.S. Patent No. 10393320). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10393320

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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