The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Jan. 25, 2017
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Kenichi Yoshida, Tokyo, JP;
Yuhei Horikawa, Tokyo, JP;
Atsushi Sato, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/42 (2006.01); C23C 18/16 (2006.01); C23C 18/32 (2006.01); C23C 18/54 (2006.01); C23C 28/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1655 (2013.01); C23C 18/1637 (2013.01); C23C 18/1651 (2013.01); C23C 18/32 (2013.01); C23C 18/42 (2013.01); C23C 18/54 (2013.01); C23C 28/02 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05644 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/14 (2013.01);
Abstract
A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.