The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Aug. 31, 2015
Toray Industries, Inc., Tokyo, JP;
Kenta Bamba, Nagoya, JP;
Tetsuya Motohashi, Nagoya, JP;
Katsuhiro Miyoshi, Nagoya, JP;
Takafumi Hashimoto, Nagoya, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A fiber-reinforced resin molding material includes at least bundled discontinuous reinforcing fiber aggregates and matrix resin, wherein said bundled reinforcing fiber aggregates include both reinforcing fiber aggregates (A) which are formed by cutting continuous reinforcing fiber strands after fiber splitting, in which said strands are completely split into multiple bundles, and reinforcing fiber aggregates (B) having at least unsplit strand sections in which fiber splitting is incomplete, an incision substantially originating from fiber splitting is present at least at one of both end portions of said reinforcing fiber aggregates (B), and a ratio of the weight of said reinforcing fiber aggregates (B) to the total weight of reinforcing fibers in said material is 5-50%.