The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Oct. 08, 2015
Applicants:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, CN;

Wuhan China Star Optoelectronics Technology Co., Ltd., Wuhan, CN;

Inventor:

Zijian Li, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 17/22 (2006.01); H01L 27/12 (2006.01); H01L 31/18 (2006.01); H01L 21/324 (2006.01); H01L 21/02 (2006.01); H01L 29/786 (2006.01); C03C 17/34 (2006.01); C03C 17/23 (2006.01); C03C 15/00 (2006.01); C03C 17/30 (2006.01);
U.S. Cl.
CPC ...
C03C 17/225 (2013.01); C03C 15/00 (2013.01); C03C 17/23 (2013.01); C03C 17/30 (2013.01); C03C 17/3435 (2013.01); C03C 17/3482 (2013.01); H01L 21/02296 (2013.01); H01L 21/02675 (2013.01); H01L 21/324 (2013.01); H01L 27/1285 (2013.01); H01L 29/786 (2013.01); H01L 31/1864 (2013.01); C03C 2217/213 (2013.01); C03C 2217/281 (2013.01); C03C 2218/33 (2013.01); C03C 2218/345 (2013.01);
Abstract

A method for manufacturing a substrate is disclosed. The method comprises the following steps: step one, depositing an amorphous silicon layer on a base material; step two, depositing a silicon dioxide layer with a first thickness on the amorphous silicon layer; and step three, etching the silicon dioxide layer until a thickness thereof is reduced to a second thickness. According to the method of the present disclosure, the silicon dioxide layer with a needed thickness can be manufactured on the amorphous silicon layer. When the ELA procedure is performed, the silicon dioxide layer has an enough thickness to prevent the formation of protrusions at grain boundary of polysilicon, so that the semi-conductive layer manufactured therein can have a relatively low roughness.


Find Patent Forward Citations

Loading…