The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Oct. 07, 2016
Applicant:

Océ-technologies B.v., Venlo, NL;

Inventors:

Hans Reinten, Venlo, NL;

René J. Van der Meer, Venlo, NL;

Maikel A. J. Huygens, Venlo, NL;

Klaas Verzijl, Venlo, NL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); B41J 2/1628 (2013.01); B41J 2002/1437 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14419 (2013.01); H01L 41/08 (2013.01);
Abstract

A process of manufacturing droplet jetting devices includes bonding together a nozzle wafer defining nozzles of the jetting devices, a membrane wafer carrying, on a membrane, actuators for generating pressure waves in a liquid in pressure chambers that are connected to the nozzles, and a distribution wafer forming a distribution layer that defines supply lines for supplying the liquid to the pressure chambers from a liquid reservoir formed on a side of the distribution layer opposite to the membrane wafer; and dicing the bonded wafers. The distribution layer has a thickness larger than the thickness of each of the other two wafers. A restrictor for controlling the inertance of the liquid supply line is formed through the distribution layer in a direction normal to the plane of that layer.


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