The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Oct. 17, 2016
Applicants:
Masaki Watanabe, Kanagawa, JP;
Tatsuya Niimi, Kanagawa, JP;
Teruki Kusahara, Kanagawa, JP;
Yoichi Sakurai, Kanagawa, JP;
Kohichiroh Tanaka, Kanagawa, JP;
Inventors:
Masaki Watanabe, Kanagawa, JP;
Tatsuya Niimi, Kanagawa, JP;
Teruki Kusahara, Kanagawa, JP;
Yoichi Sakurai, Kanagawa, JP;
Kohichiroh Tanaka, Kanagawa, JP;
Assignee:
Ricoh Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 35/04 (2006.01); B29C 67/00 (2017.01); A61K 6/08 (2006.01); A61K 6/083 (2006.01); A61C 13/08 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 70/00 (2015.01); A61C 13/00 (2006.01); A61C 13/087 (2006.01); A61C 13/09 (2006.01); A61K 6/00 (2006.01); A61K 6/087 (2006.01); B33Y 80/00 (2015.01); B29C 64/165 (2017.01); B29L 31/00 (2006.01); B28B 1/00 (2006.01);
U.S. Cl.
CPC ...
B33Y 10/00 (2014.12); A61C 13/0019 (2013.01); A61C 13/087 (2013.01); A61C 13/09 (2013.01); A61K 6/0008 (2013.01); A61K 6/0073 (2013.01); A61K 6/083 (2013.01); A61K 6/087 (2013.01); A61K 6/0835 (2013.01); B29C 64/165 (2017.08); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B28B 1/001 (2013.01); B29L 2031/753 (2013.01);
Abstract
A solid freeform fabrication material set includes a material A for solid freeform fabrication and a material B for solid freedom fabrication. The material A includes a polymerization initiator A and at least one of an organic particle and an inorganic particle. The material B includes a polymerizable compound B.