The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Aug. 27, 2016
Applicant:

B/e Aerospace Inc., Wellington, FL (US);

Inventor:

Alvin S. Bartolome, Eastvale, CA (US);

Assignee:

B/E Aerospace, Inc., Winston-Salem, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/12 (2006.01); B29C 65/02 (2006.01); B29C 65/00 (2006.01); B32B 37/14 (2006.01); B32B 15/20 (2006.01); B32B 27/06 (2006.01); B32B 5/02 (2006.01); B32B 5/12 (2006.01); B32B 5/14 (2006.01); B32B 5/28 (2006.01); B32B 7/04 (2019.01); B32B 27/04 (2006.01); B32B 27/42 (2006.01); B29C 70/08 (2006.01); B32B 7/05 (2019.01); B32B 37/18 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01); B29K 105/12 (2006.01); B29K 105/00 (2006.01); B29L 9/00 (2006.01); B32B 37/00 (2006.01); B29L 31/60 (2006.01);
U.S. Cl.
CPC ...
B32B 3/12 (2013.01); B29C 65/02 (2013.01); B29C 66/721 (2013.01); B29C 66/7254 (2013.01); B29C 66/735 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/73752 (2013.01); B29C 66/7422 (2013.01); B29C 70/08 (2013.01); B32B 5/02 (2013.01); B32B 5/12 (2013.01); B32B 5/145 (2013.01); B32B 5/28 (2013.01); B32B 7/04 (2013.01); B32B 7/05 (2019.01); B32B 15/20 (2013.01); B32B 27/04 (2013.01); B32B 27/06 (2013.01); B32B 27/42 (2013.01); B32B 37/146 (2013.01); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29K 2105/12 (2013.01); B29K 2105/253 (2013.01); B29L 2009/003 (2013.01); B29L 2031/608 (2013.01); B32B 37/182 (2013.01); B32B 2037/0092 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2255/02 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2305/076 (2013.01); B32B 2305/08 (2013.01); B32B 2305/22 (2013.01); B32B 2305/72 (2013.01); B32B 2307/718 (2013.01); B32B 2307/738 (2013.01); B32B 2311/24 (2013.01); B32B 2398/10 (2013.01); B32B 2398/20 (2013.01); B32B 2605/18 (2013.01); B32B 2607/00 (2013.01); Y10T 428/2495 (2015.01); Y10T 428/24165 (2015.01);
Abstract

A composite panel is constructed by preparing a panel assembly layup including a first prepreg layer having reinforcement material, a first layer of a resin formulation upon a first outer surface, and a second layer of the resin formulation upon an opposing outer surface, where the first layer is thinner than the second layer, and the first layer is presented toward a mold. The layup includes a core layer directly abutting the second layer. They layup includes a second prepreg layer having a first layer of the resin formulation upon a first outer surface, and a second layer of the resin formulation upon an opposing outer surface, where the first layer is thinner than the second layer, and the second layer directly abuts the core layer. The panel assembly is cured in the mold.


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