The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Feb. 15, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Jason Robert Parolini, Greer, SC (US);

John McConnell Delvaux, Fountain Inn, SC (US);

Canan Uslu Hardwicke, Simpsonville, SC (US);

Glenn Curtis Taxacher, Simpsonville, SC (US);

James Joseph Murray, Piedmont, SC (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenctady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/44 (2006.01); B29D 99/00 (2010.01); F01D 25/00 (2006.01); B32B 18/00 (2006.01); B29C 70/02 (2006.01); C04B 35/80 (2006.01); C04B 37/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/44 (2013.01); B29C 70/025 (2013.01); B29D 99/0028 (2013.01); B32B 18/00 (2013.01); C04B 35/806 (2013.01); C04B 37/001 (2013.01); F01D 25/005 (2013.01); C04B 2235/94 (2013.01); C04B 2235/95 (2013.01); C04B 2237/38 (2013.01); F05D 2260/202 (2013.01); F05D 2300/6033 (2013.01);
Abstract

A method of forming a pre-form ceramic matrix composite mold for a ceramic matrix composite (CMC) component including providing pieces of CMC remnant scrap material and randomly arranging the pieces of CMC remnant scrap material relative to one another. The method further includes debulking the pieces of CMC remnant scrap material into a rigidized shape, the rigidized shape having gaps between adjacent pieces of CMC remnant scrap material of about 10 microns and about 10 mm and a gap spacing between about 50 microns and about 50 mm, and forming the rigidized shape into a mold.


Find Patent Forward Citations

Loading…