The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Apr. 30, 2015
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventor:

Guo Yang, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/27 (2006.01); B29C 45/00 (2006.01); B29C 45/26 (2006.01); B29C 45/76 (2006.01); B29C 45/56 (2006.01);
U.S. Cl.
CPC ...
B29C 45/2737 (2013.01); B29C 45/0025 (2013.01); B29C 45/26 (2013.01); B29C 45/2602 (2013.01); B29C 45/2642 (2013.01); B29C 45/76 (2013.01); B29C 45/561 (2013.01); B29C 2045/2743 (2013.01); B29C 2945/76752 (2013.01); B29C 2945/76759 (2013.01); B29C 2945/76859 (2013.01);
Abstract

The present disclosure provides an injection molding apparatus, including a fixed mold component, a movable mold component, a first positive electrode module, and a first negative electrode module. The fixed mold component has an injection port and a transmission runner, to receive injection-molding melt. The movable mold component has a molding groove communicated with the transmission runner. The first positive electrode module and the first negative electrode module are disposed on a first side and a second side of the molding groove respectively, where the first side and the second side are opposite to each other. The first positive electrode module cooperates with the first negative electrode module to form an electric field between the first side and the second side of the molding groove, to perform electric field excitation on the injection-molding melt flowing into the molding groove.


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