The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2019
Filed:
Mar. 17, 2017
Applicant:
SK Hynix Inc., Icheon, KR;
Inventors:
Young Ju Lee, Seoul, KR;
In Hoe Kim, Seoul, KR;
Assignee:
SK HYNIX INC., Icheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/20 (2012.01); B24B 37/34 (2012.01); H01L 21/67 (2006.01); H01L 21/321 (2006.01); H01L 21/02 (2006.01); B24B 37/10 (2012.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/107 (2013.01); B24B 37/34 (2013.01); B24B 53/017 (2013.01); H01L 21/02074 (2013.01); H01L 21/3212 (2013.01); H01L 21/67092 (2013.01);
Abstract
In a method of processing a thin layer according to an embodiment, a substrate having a processing target layer is provided into a polishing module of a thin layer processing apparatus. A chemical mechanical polishing process using a polishing slurry is performed on the processing target layer. The substrate is cleaned using a cleaning slurry.