The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Dec. 30, 2015
Applicant:

Rofin-sinar Technologies Inc., Plymouth, MI (US);

Inventor:

S. Abbas Hosseini, Los Altos, CA (US);

Assignee:

ROFIN-SINAR TECHNOLOGIES LLC, Plymouth, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B23K 26/402 (2014.01); B23K 26/362 (2014.01); B23K 26/0622 (2014.01); B23K 26/364 (2014.01); B23K 26/361 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/402 (2013.01); B23K 26/0622 (2015.10); B23K 26/0624 (2015.10); B23K 26/361 (2015.10); B23K 26/362 (2013.01); B23K 26/364 (2015.10); B23K 2103/50 (2018.08);
Abstract

Very fine closed form structures can be scribed via filamentation in the transparent substrate very quickly, the modified zone can be etched via dry or wet chemical etching to release the closed form. A metal layer engages the transparent substrate and is covered with photoresist. A portion of the photoresist and a portion of the metal are removed simultaneously with the creation of a filament through the transparent substrate. The photoresist protects the portion of the metal layer that is not removed. The desired closed form can be released by weakening the cut region using dry or wet chemical etching to remove the desired part.


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