The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2019

Filed:

Dec. 12, 2013
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Armen Avoyan, Oakland, CA (US);

Cliff LaCroix, Livermore, CA (US);

Hong Shih, Walnut, CA (US);

Kennet Baylon, Santa Clara, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B08B 3/12 (2006.01); B08B 3/02 (2006.01); B08B 17/04 (2006.01); H01L 21/67 (2006.01); B08B 9/00 (2006.01);
U.S. Cl.
CPC ...
B08B 3/12 (2013.01); B08B 3/02 (2013.01); B08B 17/04 (2013.01); H01L 21/67051 (2013.01); H01L 21/6831 (2013.01); B08B 9/00 (2013.01); Y10T 137/0402 (2015.04); Y10T 137/4238 (2015.04);
Abstract

A cleaning fixture assembly for protecting an electrostatic chuck suitable for supporting semiconductor substrates during a cleaning process contains a plate configured to align with and engage a backside of the electrostatic chuck, the plate having an annular seal portion surrounding a pocket. The cleaning fixture assembly also contains a first O-ring engaging the annular seal portion of the plate, a plurality of through-holes in the pocket of the plate, and a plurality of O-rings surrounding the plurality of through-holes in the pocket of the plate. The plurality of through-holes are configured to be aligned with and in fluid communication with lift pin holes and helium holes in the backside of the electrostatic chuck, and the plurality of O-rings are positioned to allow cleaning media to engage the lift pin holes and helium holes in the electrostatic chuck during a cleaning process while sealing the cleaning media from reaching the backside of the electrostatic chuck.


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