The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Feb. 18, 2018
Applicant:

Continental Teves Ag & Co. Ohg, Frankfurt, DE;

Inventors:

Jakob Schillinger, Gaimersheim, DE;

Dietmar Huber, Rödermark, DE;

Svenja Raukopf, Gemünden Felda-Hainbach, DE;

Lothar Biebricher, Oberursel, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 1/18 (2006.01); G01R 1/20 (2006.01); G01R 19/00 (2006.01); H05K 3/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); G01R 1/203 (2013.01); G01R 19/0092 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H05K 3/0014 (2013.01); H01L 23/49531 (2013.01); H01L 2224/48265 (2013.01); H05K 2201/10022 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); Y10T 29/49146 (2015.01);
Abstract

A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.


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