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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10390409 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Dec. 29, 2017

Optical module

Applicants:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;

Hisense Broadband Multimedia Technologies, Ltd., Tortola, VG;

Inventor:

Long Zheng, Shandong, CN;

Assignees:

Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao, Shandong, CN;

Hisense Broadband Multimedia Technologies, Ltd., Tortola, VG;

Attorney:

Brinks Gilson & Lione

Primary Examiner:

Thien M Le

Int. Cl.
CPC ...
G02B 27/20 (2006.01); H05B 37/02 (2006.01); F21V 29/504 (2015.01); F21V 29/508 (2015.01); F21V 29/83 (2015.01); F21V 5/04 (2006.01); F21V 23/00 (2015.01); G02B 6/42 (2006.01); H05K 9/00 (2006.01); H04B 10/40 (2013.01); H04B 10/50 (2013.01); H04B 10/85 (2013.01); H04B 15/02 (2006.01);
U.S. Cl.
CPC ...
H05B 37/0209 (2013.01); F21V 5/04 (2013.01); F21V 23/005 (2013.01); F21V 29/504 (2015.01); F21V 29/508 (2015.01); F21V 29/83 (2015.01); G02B 6/4206 (2013.01); G02B 6/428 (2013.01); G02B 6/4214 (2013.01); G02B 6/4246 (2013.01); G02B 6/4251 (2013.01); G02B 6/4256 (2013.01); G02B 6/4274 (2013.01); G02B 6/4283 (2013.01); G02B 6/4292 (2013.01); H04B 10/40 (2013.01); H04B 10/503 (2013.01); H04B 10/85 (2013.01); H04B 15/02 (2013.01); H05K 9/0058 (2013.01);
Abstract

This application discloses an optical module, including a circuit board, a lens assembly, a laser driver, and a limiting amplifier. Heat dissipation layers are disposed on the upper and lower surfaces of the circuit board. The laser driver and the limiting amplifier are mounted on the surface of the heat dissipation layer on the upper surface. Via holes are provided in projection regions of the laser driver and the limiting amplifier on the circuit board. Via holes penetrate the circuit board and are connected to the heat dissipation layers. Via holes are filled with a heat conductor, and the heat conductor is connected to the heat dissipation layers on the upper surface and the lower surface of the circuit board. The optical module disclosed in this application effectively dissipates heat generated by the laser driver and the limiting amplifier, thereby reducing the temperature in the optical module.

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