The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Mar. 11, 2014
Applicant:

Sumitomo Osaka Cement Co., Ltd., Tokyo, JP;

Inventors:

Yoshiaki Moriya, Tokyo, JP;

Kazuto Ando, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02N 13/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H02N 13/00 (2013.01); H01L 21/6831 (2013.01); H01L 21/6875 (2013.01);
Abstract

Provided is an electrostatic chuck device in which the attachment of particles to the rear surface of a plate-like specimen can be further suppressed by suppressing the generation source of the particles and, furthermore, an effect of cooling the plate-like specimen using a cooling gas can be improved. The electrostatic chuck device is formed by including an electrostatic chuck portion in which an upper surface () of a ceramic plate-like body () is used as a placement surface on which a wafer is placed and an electrostatic adsorption electrode is provided inside the ceramic plate-like body () or on the rear surface thereof, multiple protrusions () are formed on the upper surface (), and multiple fine protrusions () are formed in regions () excluding the multiple protrusions () in the upper surface ().


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