The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Jan. 05, 2018
Applicant:

Wistron Neweb Corporation, Hsinchu, TW;

Inventors:

Shih-Hsien Tseng, Hsinchu, TW;

Chia-Hao Chang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/48 (2006.01); H01Q 5/335 (2015.01); H01Q 9/04 (2006.01); H01Q 1/24 (2006.01); H01Q 9/16 (2006.01); H01Q 9/42 (2006.01); H01Q 5/328 (2015.01); H01Q 5/371 (2015.01); H01Q 5/378 (2015.01);
U.S. Cl.
CPC ...
H01Q 5/335 (2015.01); H01Q 1/242 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 5/328 (2015.01); H01Q 5/371 (2015.01); H01Q 5/378 (2015.01); H01Q 9/0421 (2013.01); H01Q 9/16 (2013.01); H01Q 9/42 (2013.01);
Abstract

An antenna structure includes a substrate, a radiation element, a conducting element, a grounding element, a first inductor, a second inductor, and a feeding element. The radiation element is disposed on the substrate. The radiation element includes a first radiation portion, a second radiation portion, a third radiation portion, and a feeding portion connected between the first radiation portion, the second radiation portion, and the third radiation portion. The conducting element is disposed on the substrate. The conducting element connects with the feeding portion. The grounding element and the feeding portion are separated from each other. The first inductor is disposed on the substrate, and coupled between the conducting element and the grounding element. The second inductor is disposed on the substrate, and coupled between the conducting element and the grounding element.


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