The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Jun. 09, 2017
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Yoshihiro Tsutsumi, Annaka, JP;
Tadashi Tomita, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); C08G 59/24 (2006.01); C08G 59/32 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 5/527 (2006.01); C08K 7/18 (2006.01); C08K 9/02 (2006.01); H01L 33/60 (2010.01); C08G 59/22 (2006.01); C08G 59/50 (2006.01); C08K 3/00 (2018.01); C08L 63/00 (2006.01); C08K 3/014 (2018.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08G 59/226 (2013.01); C08G 59/24 (2013.01); C08G 59/3245 (2013.01); C08G 59/42 (2013.01); C08G 59/4238 (2013.01); C08G 59/5073 (2013.01); C08G 59/686 (2013.01); C08K 3/00 (2013.01); C08K 3/014 (2018.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/527 (2013.01); C08K 7/18 (2013.01); C08K 9/02 (2013.01); C08L 63/00 (2013.01); H01L 33/60 (2013.01); C08K 2003/2241 (2013.01);
Abstract
Provided are a white heat-curable epoxy resin composition capable of yielding a cured product that is tough and superior in initial reflection rate and heat resistance; and a semiconductor device with a light receiving element and other semiconductor elements being encapsulated by such cured product. The white heat-curable epoxy resin composition contains: