The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

May. 02, 2018
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Seong Kyu Jang, Ansan-si, KR;

Ji Hyeon Jeong, Ansan-si, KR;

Kyu Ho Lee, Ansan-si, KR;

Joon Hee Lee, Ansan-si, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Ansan-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/40 (2010.01); H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/44 (2010.01); H01L 33/32 (2010.01); H01L 33/20 (2010.01); H01L 33/14 (2010.01); H01L 33/06 (2010.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 27/156 (2013.01); H01L 33/0025 (2013.01); H01L 33/20 (2013.01); H01L 33/32 (2013.01); H01L 33/387 (2013.01); H01L 33/405 (2013.01); H01L 33/44 (2013.01); H01L 33/62 (2013.01); H01L 33/06 (2013.01); H01L 33/145 (2013.01);
Abstract

An ultraviolet light emitting diode is provided to comprise an n-type semiconductor layer disposed on a substrate; light emitting elements disposed on the n-type semiconductor layer, each comprising an active layer and a p-type semiconductor layer; an n-type ohmic contact layer contacting the n-type semiconductor layer around the micro light emitting elements; p-type ohmic contact layers contacting the p-type semiconductor layers, respectively; an n-bump electrically connecting to the n-type ohmic contact layer; and a p-bump electrically connected to the p-type ohmic contact layers, wherein each of the n-bump and the p-bump is disposed across over a plurality of micro light emitting elements. The micro light emitting elements may be arranged over a wide area of the substrate, and thus light output can be improved and a forward voltage may be lowered, in addition, the n-bump and the p-bump may be formed relatively widely.


Find Patent Forward Citations

Loading…