The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Jul. 28, 2015
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jin Kyung Choi, Seoul, KR;

Jun Hee Hong, Seoul, KR;

Sang Youl Lee, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/12 (2010.01); H01L 33/20 (2010.01); H01L 33/40 (2010.01); H01L 33/52 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/12 (2013.01); H01L 33/20 (2013.01); H01L 33/405 (2013.01); H01L 33/502 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2224/16245 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting device package according to an embodiment comprises: a light emitting device comprising a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; first and second lead frames disposed to be spaced apart from each other; first and second solder portions disposed on the first and second lead frames, respectively; and first and second pads disposed between the first and second solder portions and the first and second conductive semiconductor layers, respectively, wherein at least one of the first or second pad comprises at least one of a rounding portion and a chamfer portion, wherein the first pad comprises a first-first edge and a first-second edge being positioned farther than the first-first edge from the center of the light emitting device, wherein the second pad comprises a second-first edge and a second-second edge being positioned farther than the second-first edge from the center of the light emitting device, and wherein the rounding portion or the chamfer portion is positioned at at least one of the first-second edge or the second-second edge.


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