The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Nov. 24, 2017
Applicant:
Toshiba Memory Corporation, Minato-ku, JP;
Inventors:
Hayato Masubuchi, Kanagawa, JP;
Naoki Kimura, Kanagawa, JP;
Manabu Matsumoto, Kanagawa, JP;
Toyota Morimoto, Kanagawa, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01); H01L 25/18 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H01L 23/498 (2006.01); H01L 27/115 (2017.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H05K 1/18 (2006.01); H01L 23/528 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G11C 5/02 (2013.01); H01L 23/3142 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/5286 (2013.01); H01L 23/552 (2013.01); H01L 23/562 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 27/115 (2013.01); H05K 1/0225 (2013.01); H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/305 (2013.01); H01L 23/3121 (2013.01); H01L 2924/0002 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09681 (2013.01); H05K 2201/10159 (2013.01); Y02P 70/613 (2015.11);
Abstract
According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.