The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Nov. 25, 2015
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Dale Ohmart, Sugar Land, TX (US);

Balamurugan Subramanian, Plano, TX (US);

Renato Heracleo Orduna Leano, Baguio, PH;

Sonny Evangelista Dipasupil, Baguio, PH;

Ronald Jay V. Peralta, Baguio, PH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/28 (2006.01); H01L 23/544 (2006.01); G01R 31/3185 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G01R 31/2831 (2013.01); G01R 31/318511 (2013.01); H01L 22/30 (2013.01); H01L 2223/54493 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Embodiments of the invention provide a method to detect pick and place indexing errors on each manufacturing batch (lot) of semiconductor wafer processed during a die attach process using a preselected skeleton of check die. The known locations of the check skeleton die are verified during picking of die from the wafer. If the check skeleton cannot be correctly verified at the known locations, then a pick error is indicated. The embodiments may be implemented on existing die attach equipment.


Find Patent Forward Citations

Ohmart, Dale. (2019). Die attach pick error detection (U.S. Patent No. 10388609). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10388609

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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