The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10388603 B1

Date of Patent:

Aug. 20, 2019

Filed:

Mar. 30, 2018

Thin film element and method for manufacturing the same

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Toshiyuki Nakaiso, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Pete T Lee

Int. Cl.

CPC ...

H01L 23/00 (2006.01); H01L 23/528 (2006.01); H01L 29/45 (2006.01); H01L 21/768 (2006.01); H01L 21/027 (2006.01); H01L 21/288 (2006.01); H01G 4/008 (2006.01); H01G 4/33 (2006.01); H01L 27/01 (2006.01); H01G 4/228 (2006.01); H01L 23/532 (2006.01); H03H 7/01 (2006.01); H03H 3/00 (2006.01); H01L 27/02 (2006.01);

U.S. Cl.

CPC ...

H01L 23/5283 (2013.01); H01G 4/008 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01L 21/0274 (2013.01); H01L 21/2885 (2013.01); H01L 21/7685 (2013.01); H01L 21/76895 (2013.01); H01L 23/53238 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 27/016 (2013.01); H01L 29/45 (2013.01); H01L 27/0248 (2013.01); H01L 2224/03849 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13021 (2013.01); H03H 3/00 (2013.01); H03H 7/0115 (2013.01);

Abstract

A thin film element that includes a base material, a wiring conductor film disposed on the surface of the base material, a protective film that covers the surface of at least the wiring conductor film, an outer electrode, and a first resist film and a second resist film that cover the surface of the protective film. The protective film has a contact hole at a location overlapping the wiring conductor film. The outer electrode is disposed in the contact hole and on the surface of the wiring conductor film. The outer electrode is thicker than the protective film and has a side surface. The first resist film is in contact with the entire circumference of the side surface of the outer electrode, and the second resist film is disposed at a distance from the side surface of the outer electrode and the first resist film.

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