IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10388596 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Nov. 20, 2015

Electronic part mounting heat-dissipating substrate

Applicant:

Nsk Ltd., Tokyo, JP;

Inventors:

Shigeru Shimakawa, Tokyo, JP;

Takashi Sunaga, Tokyo, JP;

Takaaki Sekine, Tokyo, JP;

Teruyoshi Kogure, Tokyo, JP;

Ryoichi Suzuki, Maebashi, JP;

Assignee:

NSK LTD., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Telly D Green

Int. Cl.
CPC ...
B62D 5/04 (2006.01); G01R 1/20 (2006.01); H01C 1/14 (2006.01); H05K 7/20 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 25/07 (2006.01); H02K 11/33 (2016.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); B62D 5/0403 (2013.01); B62D 5/0406 (2013.01); B62D 5/0409 (2013.01); G01R 1/203 (2013.01); H01C 1/14 (2013.01); H01L 21/4821 (2013.01); H01L 23/48 (2013.01); H01L 23/49524 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/49861 (2013.01); H01L 25/072 (2013.01); H02K 11/33 (2016.01); H05K 7/2089 (2013.01); H01L 21/565 (2013.01); H01L 23/3735 (2013.01); H01L 23/49589 (2013.01); H01L 24/37 (2013.01); H01L 24/40 (2013.01); H01L 2224/37124 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/37599 (2013.01); H01L 2224/40 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/18301 (2013.01);
Abstract

An electronic part mounting heat-dissipating substrate which includes lead frames of wiring pattern shapes formed by conductor plate and an insulating memberwhich is provided between the lead frames, wherein a plate surface of a part arrangement surface of said conductor plate and a top surface of said insulating member at a side of said part arrangement surface form one continuous surface, the lead frames have different thicknesses, the thick lead frameH is used for a large current signal and the thin lead frameL is used for a small current signal, a plate surface of a back surface of the part arrangement surface and a top surface of the insulating member at a side of the back surface at the part arrangement surface-side are formed in an identical plane.

Find Patent Forward Citations

Loading…