The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Apr. 26, 2017
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Insung Hwang, Seoul, KR;

Wonhyeog Jin, Seoul, KR;

Moosub Kim, Seoul, KR;

Yunguk Jang, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); G01N 27/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4821 (2013.01); G01N 27/123 (2013.01); G01N 27/128 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/293 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01);
Abstract

A sensor is disclosed. The sensor comprises a first substrate; a second substrate positioned relative to the first substrate; a first electrode located between the first substrate and the second substrate, the first electrode formed on the second substrate; a sensing portion covering at least a part of the first electrode and further covering at least a portion of the second substrate; a pad electrode located between the first substrate and the second substrate, wherein the pad electrode is formed on the second substrate and is electrically coupled to the first electrode; and a bonding pad located between the first substrate and the second substrate, wherein the bonding pad is formed on the first substrate and is electrically coupled to the pad electrode.


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