The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Jan. 10, 2018
Applicant:
Facebook Technologies, Llc, Menlo Park, CA (US);
Inventors:
Oscar Torrents Abad, Saarbrucken, DE;
Pooya Saketi, Cork, IE;
Daniel Brodoceanu, Saarbrucken, DE;
Karsten Moh, Saarbrucken, DE;
Assignee:
Facebook Technologies, LLC, Menlo Park, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02354 (2013.01); H01L 21/02118 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/33 (2013.01); H01L 24/98 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/30505 (2013.01); H01L 2224/30519 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33505 (2013.01); H01L 2224/83035 (2013.01); H01L 2224/83039 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83939 (2013.01); H01L 2224/83948 (2013.01); H01L 2224/98 (2013.01);
Abstract
One or more chips are transferred from one substrate to another by using one or more polymer layers to secure the one or more chips to an intermediate carrier substrate. While secured to the intermediate carrier substrate, the one or more chips may be transported or put through further processing or fabrication steps. To release the one or more chips, the adhesion strength of the one or more polymer layers is gradually reduced to minimize potential damage to the one or more chips.