The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Jul. 18, 2016
Applicant:

Shenzhen Longsys Electronics Co., Ltd., Shenzhen, CN;

Inventors:

Zhixiong Li, Shenzhen, CN;

Weiwen Pang, Shenzhen, CN;

Xiaoqiang Li, Shenzhen, CN;

Honghui Hu, Shenzhen, CN;

Jinmou Qin, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01); G11C 5/04 (2006.01); G06F 1/16 (2006.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01); G11C 5/14 (2006.01); H01R 24/64 (2011.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01R 107/00 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
G11C 5/04 (2013.01); G06F 1/16 (2013.01); G06F 13/409 (2013.01); G06F 13/4068 (2013.01); G06F 13/4282 (2013.01); G11C 5/14 (2013.01); H01R 24/64 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); G06F 2213/0032 (2013.01); H01R 2107/00 (2013.01); H05K 3/284 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10181 (2013.01);
Abstract

A SSD storage module comprising a printed circuit board (), an encapsulating colloid (), and an electronic circuit () welded on an inner surface of the printed circuit board () and having a data storage function; the encapsulating colloid () is formed on the inner surface of the printed circuit board () and is configured for seamlessly encapsulating the electronic circuit (), an outer surface of the printed circuit board () is provided with a plurality of metal contact pieces (), the plurality of metal contact pieces () are electrically connected with the electronic circuit (), and the plurality of metal contact pieces () comprise a plurality of SATA interface contact pieces (). The encapsulating colloid () seamlessly encapsulates the electronic circuit () and isolates the electronic circuit () from the air, such that a problem that the electronic circuit () is directly exposed to the air, and performances of components of the electronic circuit () may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.


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