The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Jul. 23, 2014
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Taizo Nishimura, Kanagawa, JP;

Fumihiko Iida, Kanagawa, JP;

Hiroshi Mizuno, Kanagawa, JP;

Yasuyuki Abe, Kanagawa, JP;

Takayuki Tanaka, Kanagawa, JP;

Hayato Hasegawa, Kanagawa, JP;

Shogo Shinkai, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); G06F 3/041 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G06F 3/041 (2013.01); G06F 3/0412 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04106 (2013.01);
Abstract

A sensor device includes: a sensor layer provided at a position facing a surface, of a substrate having an operation surface, opposite to the operation surface, and configured to detect a contacted position or a pressed position on the operation surface; and a gap layer located in a gap between the substrate and the sensor layer. The gap layer includes a bonding region bonding the substrate to the sensor layer, and a relaxation region relaxing stress applied from the substrate to the sensor layer.


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