The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Jun. 09, 2017
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Donald G Godfrey, Phoenix, AZ (US);

Brian G Baughman, Surprise, AZ (US);

Soeren Wiener, Scottsdale, AZ (US);

Niranjan Kalyandurg, Bangalore, IN;

Assignee:

HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 19/4099 (2006.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); B29C 64/393 (2017.08); B33Y 50/02 (2014.12); G05B 2219/32368 (2013.01);
Abstract

Additive Manufacturing Quality Management (AMQM) systems and methods are provided, which enhance quality control across Additive Manufacturing (AM) supply chains from which AM components are obtained. In various embodiments, the AMQM system includes an AM machine utilized to produce AM components in accordance with AM design data. A first sensor is coupled to the AM machine and, during fabrication of AM components by the AM machine, captures sensor readings pertaining to the AM fabrication process. When executed by a processor, computer-executable code causes the AMQM system to: (i) compile part-specific sensor profiles from sensor readings captured by the first sensor during fabrication of the AM components, and (ii) generate user notifications indicating whether remedial action should be performed for any of the AM components based, at least in part, on conformance of the part-specific sensor profiles with a baseline sensor profile corresponding to the AM design data.


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