The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
May. 18, 2016
Applicant:
Ngk Insulators, Ltd., Aichi-prefecture, JP;
Inventors:
Assignee:
NGK INSULATORS, LTD., Aichi-prefecture, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08K 7/24 (2006.01); B32B 5/16 (2006.01); F02F 3/12 (2006.01); B32B 5/30 (2006.01); C04B 38/00 (2006.01); F02F 1/00 (2006.01); F02F 1/24 (2006.01); F02F 1/42 (2006.01); B32B 9/00 (2006.01); B32B 27/20 (2006.01); C04B 35/48 (2006.01);
U.S. Cl.
CPC ...
F02F 3/12 (2013.01); B32B 5/16 (2013.01); B32B 5/30 (2013.01); B32B 9/005 (2013.01); B32B 27/20 (2013.01); C04B 35/48 (2013.01); C04B 38/00 (2013.01); C08K 7/24 (2013.01); F02F 1/00 (2013.01); F02F 1/24 (2013.01); F02F 1/42 (2013.01); B32B 2264/102 (2013.01); B32B 2307/304 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/554 (2013.01); C01P 2004/20 (2013.01); C01P 2004/22 (2013.01); C04B 2201/30 (2013.01); C04B 2201/32 (2013.01); C04B 2235/3246 (2013.01); C04B 2235/6025 (2013.01); F02F 2001/249 (2013.01);
Abstract
In a heat-insulation film, porous plate fillers are dispersed in a matrix to bond the porous plate fillers. The porous plate filler includes plates having an aspect ratio of 3 or more, a minimum length of 0.1 to 50 μm and a porosity of 20 to 90%. In the heat-insulation film, a volume ratio between the porous plate fillers and the matrix is from 50:50 to 95:5. In the heat-insulation film in which the porous plate fillers are used, a length of a heat transfer path increases and a thermal conductivity can be decreased, as compared with a case where spherical or cubic fillers are used.