The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Nov. 17, 2015
Applicant:
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Inventors:
Toshio Ito, Niigata-ken, JP;
Hidetaka Ito, Niigata-ken, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
D04H 1/64 (2012.01); B05D 1/30 (2006.01); B05D 1/28 (2006.01); B05D 1/02 (2006.01); B05D 1/18 (2006.01); B05D 3/04 (2006.01); B05D 7/24 (2006.01); B05D 3/02 (2006.01); D04H 1/4209 (2012.01); D04H 1/58 (2012.01);
U.S. Cl.
CPC ...
D04H 1/64 (2013.01); B05D 1/02 (2013.01); B05D 1/18 (2013.01); B05D 1/28 (2013.01); B05D 1/30 (2013.01); B05D 1/305 (2013.01); B05D 3/0254 (2013.01); B05D 3/0413 (2013.01); B05D 3/0493 (2013.01); B05D 7/24 (2013.01); D04H 1/4209 (2013.01); D04H 1/58 (2013.01); B05D 2203/30 (2013.01);
Abstract
A main object of the present invention is to provide a method for manufacturing a binder-containing inorganic fiber molded body where localization of the binder is inhibited. The present invention achieves the object by providing a method for manufacturing a binder-containing inorganic fiber molded body including steps of: a binder solution coating step of coating an inorganic fiber molded body with a binder solution, and a liquid coating step of coating the inorganic fiber molded body coated with the binder solution with a liquid of which boiling point is less than 120° C.