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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10385427 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Dec. 15, 2015

Wire rod

Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Toshiyuki Manabe, Chiba, JP;

Arata Iso, Chiba, JP;

Naoki Matsui, Kisarazu, JP;

Assignee:

NIPPON STEEL CORPORATION, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Brian D Walck

Int. Cl.
CPC ...
C22C 38/02 (2006.01); C22C 38/00 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/14 (2006.01); C22C 38/18 (2006.01); C22C 38/28 (2006.01); C22C 38/32 (2006.01); C22C 38/22 (2006.01); C22C 38/24 (2006.01); C22C 38/26 (2006.01); C21D 9/52 (2006.01); C21D 8/06 (2006.01);
U.S. Cl.
CPC ...
C22C 38/28 (2013.01); C21D 9/525 (2013.01); C22C 38/00 (2013.01); C22C 38/001 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/14 (2013.01); C22C 38/22 (2013.01); C22C 38/24 (2013.01); C22C 38/26 (2013.01); C22C 38/32 (2013.01); C21D 8/065 (2013.01); C21D 2211/009 (2013.01);
Abstract

A wire rod according to an aspect of the present invention has a predetermined chemical composition, a solute N is 0.0015% or less, a structure in an area from a surface of the wire rod to a depth of ¼ of a diameter of the wire rod in a cross section thereof includes 90.0 area % or more of pearlite, and 0 to 10.0 area % in total of bainite and ferrite, a total amount of martensite and cementite in the area from the surface of the wire rod to the depth of ¼ of the diameter of the wire rod is limited to 2.0 area % or less, and the calculated maximum size of TiN-type inclusions in a surface layer area of the wire rod is 50 μm or less.

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