The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

Jun. 12, 2017
Applicant:

Nano and Advanced Materials Institute Limited, Hong Kong, HK;

Inventors:

Haojun Zhu, Hong Kong, HK;

Changbao Ren, Hong Kong, HK;

Lai To Leung, Hong Kong, HK;

Kwok Keung Paul Ho, Hong Kong, HK;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 3/04 (2006.01); C08K 3/34 (2006.01); C08K 7/00 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/042 (2017.05); C08K 3/34 (2013.01); C08K 7/00 (2013.01); C08K 7/18 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01);
Abstract

A method of preparing a thermally conductive composite including: a) mixing 15% to 60% by weight of a polymer matrix with 0% to 85% by weight of a high-aspect-ratio thermally conductive filler having an aspect ratio of at least 5:1; and (b) mixing a polymer melt obtained from step (a) with 0% to 85% by weight of a low-aspect-ratio thermally conductive filler having an aspect ratio of 2:1 or less. By changing the weight ratio, the structure and mechanical properties of the low-aspect-ratio thermally conductive filler and the high-aspect-ratio thermally conductive filler, thermal conductivity anisotropy can be tuned. A thermally conductive composite having thermal conductivity anisotropy in the range from 1 to 4 is also disclosed.


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