The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2019

Filed:

May. 29, 2013
Applicant:

Teijin Limited, Osaka, JP;

Inventors:

Hiroshi Kishimoto, Chiba, JP;

Yume Morita, Ehime, JP;

Yukiko Uzawa, Ehime, JP;

Daisuke Takahashi, Chiba, JP;

Assignee:

TEIJIN LIMITED, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 175/02 (2006.01); C09J 7/24 (2018.01); C09J 175/04 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); C09J 7/22 (2018.01); C09J 7/50 (2018.01); C09J 7/25 (2018.01); C09J 7/29 (2018.01);
U.S. Cl.
CPC ...
C09J 7/24 (2018.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/308 (2013.01); B32B 27/365 (2013.01); C09J 7/22 (2018.01); C09J 7/25 (2018.01); C09J 7/29 (2018.01); C09J 7/50 (2018.01); C09J 175/04 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/412 (2013.01); B32B 2307/51 (2013.01); B32B 2307/558 (2013.01); C09J 2201/122 (2013.01); C09J 2201/162 (2013.01); C09J 2433/006 (2013.01); C09J 2469/006 (2013.01); C09J 2475/00 (2013.01); C09J 2483/003 (2013.01); Y10T 428/265 (2015.01); Y10T 428/31663 (2015.04);
Abstract

An adhesive laminate comprising (A) a light-transmitting substrate layer formed from a melt extruded thermoplastic resin, (B) a hard coat layer formed by using a hard coating agent comprising not less than 13 wt % of colloidal silica and/or an alkoxysilane hydrolysis condensate based on the total weight of the layer B excluding a solvent, (C) an adhesive primer layer, and (D) an elastic adhesive layer. Layers (A)-(D) are formed in this order. Layer C is formed from a primer composition comprising a silane coupling agent and has a thickness of 1 to 20 μm and an indentation elasticity modulus of 500 to 4,000 MPa. Layer D has a thickness (Y) of 0.9 to 14 mm.


Find Patent Forward Citations

Kishimoto, Hiroshi. (2019). Adhesive laminate (U.S. Patent No. 10385238). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10385238

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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