logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10385166 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Apr. 08, 2016

Polyamide resin, polyamide resin composition containing same, preparation method therefor, and molded product including same

Applicant:

Lotte Advanced Materials Co., Ltd., Yeosu-si, KR;

Inventors:

So Young Kwon, Uiwang-si, KR;

Joon Sung Kim, Uiwang-si, KR;

Jin Kyu Kim, Uiwang-si, KR;

Sang Kyun Im, Uiwang-si, KR;

Il Kyoung Kwon, Uiwang-si, KR;

Ki Chul Son, Uiwang-si, KR;

Young Sub Jin, Uiwang-si, KR;

Sung Chul Choi, Uiwang-si, KR;

Assignee:

Lotte Advanced Materials Co., Ltd., Yeosu-si, KR;

Attorney:

Additon, Higgins & Pendleton, P.A.

Primary Examiner:

Brieann R Johnston

Int. Cl.
CPC ...
C08J 5/04 (2006.01); C08K 3/00 (2018.01); C08K 5/00 (2006.01); C08K 7/14 (2006.01); C08G 69/26 (2006.01); C08G 73/02 (2006.01); C08L 77/06 (2006.01); C08L 79/02 (2006.01);
U.S. Cl.
CPC ...
C08G 69/26 (2013.01); C08G 69/265 (2013.01); C08G 73/028 (2013.01); C08J 5/043 (2013.01); C08K 3/00 (2013.01); C08K 5/00 (2013.01); C08L 77/06 (2013.01); C08J 2367/02 (2013.01);
Abstract

The polyamide resin of the present invention is a polymer of a monomer mixture including a dicarboxylic acid and an amine-based compound, wherein the amine-based compound comprises diamine and triamine and a branching rate measured usingH-NMR is approximately 1% to approximately 8%.

Find Patent Forward Citations

Kwon, So. (2019). Polyamide resin, polyamide resin composition containing same, preparation method therefor, and molded product including same (U.S. Patent No. 10385166). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10385166

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…