The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Apr. 20, 2016
Applicants:
Hyundai Motor Company, Seoul, KR;
Kia Motors Corporation, Seoul, KR;
Inventors:
Hyun Min Kang, Seongnam-si, KR;
Deok Woo Yun, Hwaseong-si, KR;
Assignees:
HYUNDAI MOTOR COMPANY, Seoul, KR;
KIA MOTORS CORPORATION, Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29L 9/00 (2006.01); B32B 7/04 (2019.01); B32B 7/08 (2019.01); D03D 1/00 (2006.01); B29C 65/02 (2006.01); B29C 65/62 (2006.01); B29C 70/00 (2006.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 31/00 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01); B32B 38/08 (2006.01); D03D 13/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/62 (2013.01); B29C 65/02 (2013.01); B29C 70/00 (2013.01); B32B 7/04 (2013.01); B32B 7/08 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 38/08 (2013.01); D03D 1/00 (2013.01); D03D 13/002 (2013.01); B29K 2023/00 (2013.01); B29K 2023/10 (2013.01); B29K 2025/04 (2013.01); B29K 2031/04 (2013.01); B29L 2009/00 (2013.01); B32B 37/0046 (2013.01); B32B 37/06 (2013.01); B32B 37/1027 (2013.01); B32B 2038/008 (2013.01); B32B 2250/24 (2013.01); B32B 2250/242 (2013.01); B32B 2262/0253 (2013.01); B32B 2307/51 (2013.01); B32B 2307/54 (2013.01); B32B 2309/02 (2013.01); D10B 2505/02 (2013.01);
Abstract
A method of preparing a thermoplastic resin composite includes laminating a matrix resin layer and a reinforcing resin layer to prepare a resin laminate, and heat-bonding the resin laminate, and prior to the step of heat-bonding the resin laminate, fixing one or more selected from the group consisting of the reinforcing resin layer and the resin laminate using a stitch resin having a draw ratio of less than 10:1 and a melting point of 150° C. or lower.