The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
Feb. 13, 2018
Applicant:
Protec Co., Ltd., Gyeonggi-do, KR;
Inventors:
Moo Sup Shim, Seoul, KR;
Seong Yong Ji, Seoul, KR;
Hyoung Yeon Ju, Daejeon, KR;
Chiho Cho, Incheon, KR;
Assignee:
PROTEC CO., LTD., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/06 (2006.01); B23K 3/08 (2006.01); B23K 1/00 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0623 (2013.01); B23K 1/0016 (2013.01); B23K 3/087 (2013.01); H01L 24/741 (2013.01); H05K 3/3426 (2013.01); B23K 2101/36 (2018.08); H05K 2201/10757 (2013.01); H05K 2203/041 (2013.01);
Abstract
A method of bonding a flexible part including inclined leads is provided, and more particularly, a method of bonding a flexible part including inclined leads, in which parts are aligned to bond the parts is provided. According to the method of bonding the flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.