IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10383572 B1

PDFFull Text
Date of Patent:
Aug. 20, 2019

Filed:

Jun. 01, 2017

Via and trench filling using injection molded soldering

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John U. Knickerbocker, Monroe, NY (US);

Shriya Kumar, New York, NY (US);

Jae-Woong Nah, Closter, NJ (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

L. Jeffrey Kelly

Ryan, Mason & Lewis, LLP

Primary Examiner:

Bitew A Dinke

Int. Cl.
CPC ...
H05K 3/40 (2006.01); A61B 5/00 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01); H01L 21/48 (2006.01); H05K 1/03 (2006.01); H01L 23/00 (2006.01); A61M 5/00 (2006.01); B23K 3/06 (2006.01); H01L 23/66 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); B23K 101/36 (2006.01); H01L 23/538 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
A61B 5/68 (2013.01); A61M 5/00 (2013.01); B23K 3/0638 (2013.01); H01L 21/486 (2013.01); H01L 21/76816 (2013.01); H01L 21/76852 (2013.01); H01L 21/76883 (2013.01); H01L 21/76898 (2013.01); H01L 23/13 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/53228 (2013.01); H01L 23/53238 (2013.01); H01L 23/53242 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01); H01L 23/66 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/64 (2013.01); H01L 24/69 (2013.01); H01L 24/83 (2013.01); H01L 24/89 (2013.01); H05K 1/0306 (2013.01); H05K 3/4038 (2013.01); A61B 2562/12 (2013.01); A61M 2207/00 (2013.01); B23K 2101/36 (2018.08); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/5389 (2013.01); H01L 23/53233 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/27312 (2013.01); H01L 2224/325 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32235 (2013.01); H01L 2224/64 (2013.01); H01L 2224/69 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/89 (2013.01); H01L 2224/96 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15332 (2013.01); H05K 2201/0305 (2013.01);
Abstract

A method includes forming one or more vias in a substrate, forming a first photoresist layer on a top surface of the substrate and a second photoresist layer on a bottom surface of the substrate, patterning the first photoresist layer and the second photoresist layer to remove at least a first portion of the first photoresist layer and at least a second portion of the second photoresist layer, filling the one or more vias, the first portion and the second portion with solder material using injection molded soldering, and removing remaining portions of the first photoresist layer and the second photoresist layer.

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