The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

May. 01, 2017
Applicant:

Nissha Co., Ltd., Kyoto-shi, JP;

Inventors:

Seiichi Yamazaki, Kyoto, JP;

Toshihiro Iga, Kyoto, JP;

Yasuisa Takinishi, Kyoto, JP;

Assignee:

NISSHA CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); B29C 45/14 (2006.01); B32B 27/08 (2006.01); H05K 3/32 (2006.01); H05K 3/00 (2006.01); H05K 1/18 (2006.01); B29C 70/72 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/32 (2013.01); B29C 45/14016 (2013.01); B29C 45/14467 (2013.01); B32B 27/08 (2013.01); H05K 1/115 (2013.01); H05K 3/0014 (2013.01); B29C 45/14 (2013.01); B29C 70/72 (2013.01); B29C 2045/1454 (2013.01); B29C 2045/14147 (2013.01); B29C 2045/14163 (2013.01); B29C 2045/14532 (2013.01); B29K 2995/0007 (2013.01); B29L 2031/34 (2013.01); B32B 2307/206 (2013.01); B32B 2457/00 (2013.01); H05K 1/028 (2013.01); H05K 1/0284 (2013.01); H05K 1/189 (2013.01); H05K 2201/09209 (2013.01); H05K 2203/1327 (2013.01);
Abstract

A molding with an integrated electrode pattern, including a resin molded body having a first surface and a second surface opposing each other; a first film that is formed on the first surface and that includes an electrode pattern and a first lead-out wire electrically connected to the electrode pattern, the first film not being covered by the resin molded body; and a second film that stands on the first surface, and that includes a second lead-out wire electrically connected to the first lead-out wire, the second film having a rectangular shape, and the resin molded body includes a pair of support wall portions formed integrally with the first surface so as to stand on the first surface and clamp both ends of a base part of the second film.


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