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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10383232 B1

PDFFull Text
Date of Patent:
Aug. 13, 2019

Filed:

Mar. 27, 2018

Thermoformed plastic cover for electronics and related method of manufacture

Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Mikko Heikkinen, Oulu, FI;

Jarmo Sääski, Kempele, FI;

Jarkko Torvinen, Kempele, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:

Robert P. Michal, Esq.

Carter, DeLuca & Farrell LLP

Primary Examiner:

Ngan V Ngo

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H01L 33/52 (2010.01); H01L 51/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01); H01L 33/52 (2013.01); H01L 51/0097 (2013.01); H05K 1/0274 (2013.01); H05K 1/0298 (2013.01); H05K 3/284 (2013.01); H01L 2224/1319 (2013.01); H01L 2933/005 (2013.01); H05K 1/189 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/05 (2013.01); H05K 2201/09872 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1322 (2013.01);
Abstract

A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.

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