logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10383231 B1

PDFFull Text
Date of Patent:
Aug. 13, 2019

Filed:

Feb. 08, 2013

Component-embedded board and method of manufacturing same

Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Yoshinori Sano, Sakura, JP;

Masahiro Okamoto, Sakura, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:

Osha Liang LLP

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/538 (2006.01); H05K 3/46 (2006.01); H01L 23/12 (2006.01); H01L 23/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); H01L 23/145 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/186 (2013.01); H05K 3/002 (2013.01); H05K 3/0032 (2013.01); H05K 3/4038 (2013.01); H05K 3/4697 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/73267 (2013.01); H05K 3/427 (2013.01); H05K 2201/09818 (2013.01); H05K 2203/061 (2013.01);
Abstract

Provided is a component-embedded board which includes: a first board including a first insulation layer, a first conductive layer formed on a second face of the first insulation layer, and an interlayer conductive portion penetrating the first insulation layer to be connected to the first conductive layer and protruding from a first face of the first insulation layer; an electric component connected to the interlayer conductive portion; and a second board including a second insulation layer having an opening portion incorporating the electric component, and a second conductive layer formed on at least either one of a first face and a second face of the second insulation layer. The second conductive layer includes a frame portion. The opening portion is formed so as to penetrate the second insulation layer in a thickness direction thereof over the entirety of the inner region of the frame portion.

Find Patent Forward Citations

Loading…