The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2019
Filed:
Apr. 10, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Sang-Gi Oh, Yongin-si, KR;
Sang Hyuk Wi, Yongin-si, KR;
Chang Geun Yu, Bucheon-si, KR;
Sang Ho Hong, Suwon-si, KP;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); F21V 8/00 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01); H01P 3/12 (2006.01); H05K 1/18 (2006.01); G02F 1/1333 (2006.01); G02F 1/1345 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01); H01P 11/00 (2006.01); H04N 5/64 (2006.01);
U.S. Cl.
CPC ...
H05K 1/142 (2013.01); G02B 6/0085 (2013.01); G02F 1/13452 (2013.01); G02F 1/133308 (2013.01); G06F 1/1601 (2013.01); G06F 1/1637 (2013.01); G06F 1/20 (2013.01); H01P 3/122 (2013.01); H05K 1/0237 (2013.01); H05K 1/0274 (2013.01); H05K 1/18 (2013.01); H05K 5/0017 (2013.01); G02B 6/0055 (2013.01); G02F 2001/13332 (2013.01); G02F 2001/133314 (2013.01); G02F 2001/133317 (2013.01); H01P 11/002 (2013.01); H04N 5/64 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10257 (2013.01);
Abstract
A display apparatus including a waveguide is provided. The display apparatus includes a display panel; a backlight configured to provide light to the display panel; a heat sink configured to absorb heat generated by the backlight; a bottom chassis configured to support the backlight and the heat sink; a first circuit board mounted on the bottom chassis; a second circuit board mounted on the bottom chassis; and a waveguide formed between the first circuit board and the second circuit board.