The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Aug. 10, 2018
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Michael J. Peterson, Prior Lake, MN (US);

Michael R. Fabry, Apple Valley, MN (US);

Sean M. Horgan, Shakopee, MN (US);

Assignee:

Seagate Technology LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/532 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/113 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H05K 3/4038 (2013.01); H05K 2201/029 (2013.01);
Abstract

Aspects of the disclosure are directed to apparatuses and methods involving an electrical connector and methods thereof. As may be consistent with one or more embodiments, an interposer includes respective barrier layers having barrier material that is coplanar with, and laterally surrounds, traces having connected via pads. Vias connect pads of stacked pairs of the traces in different ones of the barrier layers. The traces vary in width along their respective lengths. The barrier material is offset from each trace by a continuous gap having a length extending around the trace, with the gaps extending around each stacked pair being offset from one another along the majority of their respective lengths.


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