The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Mar. 17, 2016
Applicant:

Stanley Electric Co., Ltd., Meguro-ku, Tokyo, JP;

Inventor:

Akihiko Hanya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/66 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H05K 1/0265 (2013.01); H05K 1/097 (2013.01); H05K 3/1283 (2013.01); H05K 3/3494 (2013.01); H01L 2224/16225 (2013.01); H05K 1/095 (2013.01); H05K 3/125 (2013.01); H05K 3/1275 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09736 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/1581 (2013.01);
Abstract

An electronic device capable of supplying a large current to a circuit pattern containing conductive nanoparticles includes a substrate, a region provided on the substrate, configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region. At least a part of the first circuit pattern includes a layer obtained by sintering conductive nanosized particles with a diameter of less than 1 μm. The second circuit pattern is thicker than the first circuit pattern.


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