The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

May. 24, 2018
Applicant:

Osram Gmbh, Munich, DE;

Inventors:

Philipp Helbig, Heidenheim, DE;

Sebastian Jooss, Dettingen, DE;

Assignee:

OSRAM GmbH., Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H05K 1/14 (2006.01); F21V 29/70 (2015.01); H05K 3/00 (2006.01); H01L 25/075 (2006.01); F21Y 115/10 (2016.01); H05K 1/11 (2006.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); F21V 29/70 (2015.01); H01L 23/3677 (2013.01); H01L 23/49838 (2013.01); H01L 25/0753 (2013.01); H05K 1/0204 (2013.01); H05K 1/145 (2013.01); H05K 3/0061 (2013.01); H05K 3/341 (2013.01); F21Y 2115/10 (2016.08); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01); H01L 2933/0075 (2013.01); H05K 1/0265 (2013.01); H05K 1/111 (2013.01); H05K 1/183 (2013.01);
Abstract

An electronic assembly for lighting applications. The assembly includes a printed circuit board (PCB) having a first PCB surface, which is designed for populating with electronic components, and a second PCB surface opposite the first PCB surface. The PCB has a continuous cutout from the first PCB surface to the second PCB surface. The electronic assembly further includes a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface. The first contact surface is connected in a material-bonded manner to the PCB arranged in parallel therewith at the second printed circuit board surface. The electronic assembly further includes at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface.


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