The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Feb. 20, 2015
Applicants:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, s-Gravenhage, NL;

Imec Vzw, Leuven, BE;

Inventors:

Sandeep Unnikrishnan, s-Gravenhage, NL;

Philippe Vereecken, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/70 (2006.01); H01M 4/04 (2006.01); H01M 4/66 (2006.01); H01M 10/04 (2006.01); H01M 10/0562 (2010.01); H01M 10/0585 (2010.01); H01M 6/40 (2006.01); H01M 10/0525 (2010.01); H01G 9/20 (2006.01); H01M 10/052 (2010.01); H01L 31/0224 (2006.01);
U.S. Cl.
CPC ...
H01M 4/70 (2013.01); H01M 4/0442 (2013.01); H01M 4/661 (2013.01); H01M 6/40 (2013.01); H01M 10/0436 (2013.01); H01M 10/0525 (2013.01); H01M 10/0562 (2013.01); H01M 10/0585 (2013.01); H01G 9/20 (2013.01); H01L 31/022425 (2013.01); H01M 4/045 (2013.01); H01M 4/0423 (2013.01); H01M 4/0428 (2013.01); H01M 10/052 (2013.01); Y02E 10/52 (2013.01); Y02E 60/122 (2013.01); Y02P 70/54 (2015.11);
Abstract

An method for manufacturing a electronic device is provided having a current collector capable of a high specific charge collecting area and power, but is also achieved using a simple and fast technique and resulting in a robust design that may be flexed and can be manufactured in large scale processing. To this end the electronic device comprising an electronic circuit equipped with a current collector formed by a metal substrate having a face forming a high-aspect ratio structure of pillars having an interdistance larger than 600 nm. By forming the high-aspect structure in a metal substrate, new structures can be formed that are conformal to curvature of a macroform or that can be coiled or wound and have a robust design.


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