The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Nov. 04, 2015
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Junichi Nakadate, Osaka, JP;

Taehyung Cho, Osaka, JP;

Takahiko Sawada, Osaka, JP;

Yuki Kanaoka, Osaka, JP;

Masahiko Gotoh, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/02 (2006.01); H01M 2/16 (2006.01); C08F 2/00 (2006.01); C08F 2/46 (2006.01); C08J 9/36 (2006.01); C08J 7/06 (2006.01); B29C 71/02 (2006.01); C08J 7/12 (2006.01); H01M 2/14 (2006.01); H01M 10/0525 (2010.01); C08J 7/18 (2006.01);
U.S. Cl.
CPC ...
H01M 2/1686 (2013.01); C08F 2/00 (2013.01); C08F 2/46 (2013.01); C08J 7/06 (2013.01); C08J 7/08 (2013.01); C08J 7/123 (2013.01); C08J 7/18 (2013.01); C08J 9/36 (2013.01); H01M 2/145 (2013.01); H01M 2/16 (2013.01); H01M 2/1653 (2013.01); H01M 10/0525 (2013.01); C08J 2323/12 (2013.01); C08J 2435/02 (2013.01); H01M 2220/30 (2013.01);
Abstract

Provided are a heat-resistant synthetic resin microporous film that has both good heat resistance and good mechanical strength and exhibits a suppressed decrease in mechanical strength over time, and a method for producing the heat-resistant synthetic resin microporous film. The heat-resistant synthetic resin microporous film of the present invention includes a synthetic resin microporous film, and a coating layer formed on at least part of the surface of the synthetic resin microporous film and containing a polymer of a polymerizable compound having two or more radically polymerizable functional groups per molecule. The maximum thermal shrinkage rate of the heat-resistant synthetic resin microporous film when heated from 25° C. to 180° C. at a temperature rising rate of 5° C./min is 15% or less. The piercing strength thereof is 0.6 N or more. The rate of retention of the piercing strength after heating at 70° C. for 168 hours is 85% or more.


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