The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2019

Filed:

Dec. 30, 2015
Applicant:

Rayvio Corporation, Hayward, CA (US);

Inventors:

Saijin Liu, Hayward, CA (US);

Douglas A. Collins, Hayward, CA (US);

Assignee:

RayVio Corporation, Hayward, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/642 (2013.01); H05K 1/021 (2013.01); H01L 2224/73265 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Embodiments of the invention include a light emitting diode (LED) including a semiconductor structure. The semiconductor structure includes an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The LED is disposed on the mount. The mount is disposed on a conductive slug. A support surrounds the conductive slug. The support includes electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED.


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